Memory Heatsink Set With Supplementary Retaining Devices

ABSTRACT

A memory heatsink set for dissipating heat from a memory module is disclosed to include a first memory heatsink and a second memory heatsink, two guide devices bilaterally provided between the first memory heatsink and the second memory heatsink for positioning during the assembly process of the memory heatsink set and for guiding the first memory heatsink and the second memory heatsink into alignment, and two supplementary retaining devices respectively provided at two ends between the first memory heatsink and the second memory heatsink, each supplementary retaining device having a main engagement opening and two lateral sub-engagement openings located on one end of the first memory heatsink and a main engagement block and two lateral sub-engagement blocks located on the corresponding end of the second memory heatsink for engaging the main engagement opening and the two lateral sub-engagement openings respectively.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a memory heatsink set with supplementaryretaining devices for dissipating heat from a memory module (DynamicRandom Access Memory, DRAM) and more particularly, to a memory heatsinkset with supplementary retaining devices that provide an engagingfunction for positioning securely on two opposite sides of the memorymodule.

2. Description of Related Art

Nowadays, computer system has become a part of our daily life. Manypeople use computer system daily as a requisite operation tool.Following fast development of computer technology, the performance ofcomputer system has been greatly improved. The rise of computerperformance results in rise of waste heat from computer components. Tosolve waste heat problem, heat dissipation device such as heatsinkbecomes necessary.

Memory heatsinks are intensively used with memory modules for heatdissipation. A known technique is to hook one side of each of two memoryheatsinks up together, and then to turn the other side of the two memoryheatsinks outwards from each other for insertion of a memory module intothe gap between the two memory heatsinks According to this known design,as shown in FIGS. 6 and 7, the memory heatsink set comprises a firstmemory heatsink 50 and a second memory heatsink 60. The first memoryheatsink 50 has a female engagement member 51 and a male engagementmember 52 located on one end thereof. The second memory heatsink 60 hasa female engagement member 61 and a male engagement member 62 located onone end thereof corresponding to the male engagement member 52 andfemale engagement member 51 of the first memory heatsink 50. Duringinstallation, the respective male engagement members 52 and 62 arerespectively engaged into the respective female engagement members 61and 51. After engagement between the respective male engagement members52 and 62 and the respective female engagement members 61 and 51, thefree ends of the first memory heatsink 50 and the second memory heatsink60 are turned outwards in reversed directions for enabling a memorymodule 70 to be set in between the first memory heatsink 50 and thesecond memory heatsink 60.

The aforesaid prior art memory heatsink set is still not satisfactory infunction. During installation, the user must hold the memory module 70with one hand and the memory heatsink set with the other hand whilekeeping the free ends of the first memory heatsink 50 and the secondmemory heatsink 60 widely opened. Although the respective maleengagement members 52 and 62 are respectively kept in the respectivefemale engagement members 61 and 51 when the free ends of the firstmemory heatsink 50 and the second memory heatsink 60 are widely opened,the respective male engagement members 52 and 62 may escape from therespective female engagement members 61 and 51 accidentally uponvibration when the first memory heatsink 50 and the second memoryheatsink 60 are closed together after insertion of the memory module 70into the space between the first memory heatsink 50 and the secondmemory heatsink 60. To avoid disconnection between the first memoryheatsink 50 and the second memory heatsink 60 during installation of thememory module 70, the user must carefully manipulate the memory heatsinkset. Further, the first memory heatsink 50 and the second memoryheatsink 60 do not provide any engaging function to assure tight contactwith the memory module 70.

SUMMARY OF THE INVENTION

In view of the aforesaid circumstances, the invention provides a memoryheatsink set with supplementary retaining devices for memory module,which facilitates installation and provides an engaging function toassure tight contact with the installed memory module.

To achieve this and other objects of the present invention, a heattransfer strip set comprises:

a first memory heatsink and a second memory heatsink, the first memoryheatsink and the second memory heatsink being narrow elongated stripmembers, each having a top bearing flange perpendicularly extended fromthe top side thereof;

at least one guide device provided between the top bearing flanges ofthe first memory heatsink and the second memory heatsink for positioningduring the assembly process of the memory heatsink set and for guidingthe first memory heatsink and the second memory heatsink into alignment;

two supplementary retaining devices respectively provided at two endsbetween the first memory heatsink and the second memory heatsink, eachsupplementary retaining device comprising first engagement means andsecond engagement means respectively located on one end of the firstmemory heatsink and the corresponding end of the second memory heatsinkfor supporting a memory module in between the first memory heatsink andthe second memory heatsink, the first engagement means comprising a mainengagement opening ant at least one sub-engagement opening arranged in aparallel manner at the free end thereof, the main engagement openinghaving a relatively narrower outer end and a relatively wider inner end,the second engagement means comprising a main engagement block and atleast one sub-engagement block disposed arranged in a parallel manner atthe free end thereof for engaging the main engagement opening and atleast one sub-engagement opening of the first engagement meansrespectively, the main engagement block having a relatively thickerouter end and a relatively thinner inner end.

The first engagement means further comprises a spacer block disposedbetween the main engagement opening and each sub-engagement opening. Thespacer block has a recessed portion at the root thereof. Further, eachsub-engagement block of the second engagement means has a configurationfitting the associating sub-engagement opening, and a root expanding indirection toward the main engagement block.

The first engagement means further comprises a locating groove disposedin each sub-engagement opening; each sub-engagement block has a locatingprotrusion for engaging the locating groove in the respectivesub-engagement opening.

Further, each guide device comprises first retaining means and secondretaining means respectively located on the top bearing flange of thefirst memory heatsink and the top bearing flange of the second memoryheatsink for engagement with each other to prohibit displacement betweenthe first memory heatsink and the second memory heatsink in left-rightdirection and to hold the first memory heatsink and the second memoryheatsink in alignment. The first retaining means comprises a firstretaining block protruded from the top bearing flange of one of thefirst memory heatsink and the second retaining means; the secondretaining means comprises two second retaining blocks protruded from thetop bearing flange of the other of the first memory heatsink and thesecond memory heatsink and defining therebetween a space for theengagement of the first retaining block.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1 is an exploded view of a memory heatsink set in accordance withthe present invention.

FIG. 2 is an enlarged view of a part of FIG. 1.

FIG. 3 is a side plain view in an enlarged scale of FIG. 1.

FIG. 4 is a schematic drawing of the present invention, showingengagement between the first engagement means and second engagementmeans of one supplementary retaining device (I).

FIG. 5 is a schematic drawing of the present invention, showingengagement between the first engagement means and second engagementmeans of one supplementary retaining device (II).

FIG. 6 is an exploded top plain view of a memory heatsink set accordingto the prior art.

FIG. 7 is a schematic drawing showing a status of use the prior artmemory heatsink set.

FIG. 8 is a schematic drawing showing a status of use of the memoryheatsink set according to the present invention.

DESCRIPTION OF THE EMBODIMENTS

Referring to FIGS. 1-3, a memory heatsink set in accordance with thepresent invention is shown comprising a first memory heatsink 10, asecond memory heatsink 20, two guide devices 30, and two supplementaryretaining devices 40.

The first memory heatsink 10 and the second memory heatsink 20 arenarrow elongated strip members, each having a wing 18\28 respectivelyprotruded from each of two distal ends thereof near the top side and atop bearing flange 19\29 perpendicularly extended from the top side.

The two guide devices 30 are respectively provided between the topbearing flanges 19\29 of the first memory heatsink 10 and the secondmemory heatsink 20 for positioning during the assembly process of thememory heatsink set and for guiding the first memory heatsink 10 and thesecond memory heatsink 20 into alignment. Each guide device 30 comprisesfirst retaining means, for example, a first retaining block 31 protrudedfrom the top bearing flange 19 of the first memory heatsink 10, andsecond retaining means, for example, two second retaining blocks 32protruded from the top bearing flange 29 of the second memory heatsink20 in a parallel manner for enabling the retaining portion 31 to beengaged into the space between the two second retaining blocks 32 toprohibit displacement between the first memory heatsink 10 and thesecond memory heatsink 20 in left-right direction and to hold the firstmemory heatsink 10 and the second memory heatsink 20 in alignment.

The two supplementary retaining devices 40 are respectively provided attwo ends between the wings 18\28 of the first memory heatsink 10 and thesecond memory heatsink 20, each comprising first engagement means 41 andsecond engagement means 42 respectively perpendicularly extended fromthe wing 18 of the first memory heatsink 10 and the wing 28 of thesecond memory heatsink 20 toward each other. The first engagement means41 and the second engagement means 42 are a good match, and thereforethe positions of the first engagement means 41 and second engagementmeans 42 at the wing 18 of the first memory heatsink 10 and the wing 28of the second memory heatsink 20 can be exchanged.

According to the present preferred embodiment, the first engagementmeans 41 comprises, at the free end thereof, a main engagement opening411, two sub-engagement openings 412 located on two opposite sidesrelative to the main engagement opening 411, two spacer blocks 413respectively disposed between the main engagement opening 411 and thesub-engagement openings 412, two recessed portions 414 respectivelylocated on the roots of the spacer blocks 413 in the sub-engagementopenings 412 at one side to reduce the thickness of the roots of thespacer blocks 413, and two location grooves 432 respectively disposed inthe sub-engagement openings 412 opposite to the recessed portions 414.The main engagement opening 411 has a relatively narrower outer end anda relatively wider inner end. The configuration of the free end of thesecond engagement means 42 matches the configuration of the free end ofthe first engagement means 41. The second engagement means 42 comprisesa main engagement block 421 for engaging the main engagement opening 411of the first engagement means 41, two sub-engagement blocks 422 disposedat two sides relative to the main engagement block 421 for engaging thesub-engagement openings 412 of the first engagement means 41respectively, and two locating protrusions 431 respectively protrudedfrom the sub-engagement blocks 422 for engaging the locating grooves 432of the first engagement means 41 respectively. The sub-engagement blocks422 are configured to fit the sub-engagement openings 412, each havingthe root thereof expanding in direction toward the main engagement block421. To match the configuration of the main engagement opening 411, themain engagement block 421 has a relatively thicker outer end and arelatively thinner inner end.

Referring to FIGS. 4 and 5, during installation of the first and secondmemory heatsinks 10\20, the first retaining blocks 31 of the guidedevices 30 are respectively forced into engagement with the respectivesecond retaining blocks 32 to hold the first memory heatsink 10 and thesecond memory heatsink 20 together and to keep them in alignment. Atthis time, the first engagement means 41 of the supplementary retainingdevices 40 are respectively aimed at the respective second engagementmeans 42. Thus, the user can press the wings 18\28 of the first memoryheatsink 10 and the second memory heatsink 20 to force the firstengagement means 41 of the supplementary retaining devices 40 intoengagement with the respective second engagement means 42. When the mainengagement block 421 is being forced into the associating mainengagement opening 411, the associating spacer blocks 413 are curvedslightly outwards for allowing the main engagement block 421 to enterthe associating main engagement opening 411, and at the same time thesub-engagement blocks 422 are respectively forced into the associatingsub-engagement openings 412. Immediately after the main engagement block421 entered the associating main engagement opening 411, the spacerblocks 413 return to their former shape to clamp the relatively thinnerinner end of the associating main engagement block 421, and the locatingprotrusions 431 are respectively forced into engagement with theassociating locating grooves 432. Thus, the first engagement means 41 ofthe supplementary retaining devices 40 are respectively engaged with therespective second engagement means 42, securing the first memoryheatsink 10 and the second memory heatsink 20 positively together.

According to the aforesaid description, the memory heatsink set of thepresent invention can be assembled rapidly and accurately in a mannertotally different from that of the aforesaid prior art design. Unlikethe prior art design in which the two memory heatsink must be bentoutwards for allowing insertion of the memory module into the spacebetween the two memory heatsinks, the installation of the presentinvention is much easy. As shown in FIG. 8, the first engagement means41 or second engagement means 42 of the two supplementary retainingdevices 40 are used as positioning boundary to support the memory module80 in place, allowing the first memory heatsink 10 and the second memoryheatsink 20 to be rapidly and accurately fastened together to hold thememory module 80 therebetween.

Although a particular embodiment of the invention has been described indetail for enabling any person skilled in the art to know the invention,various modifications and enhancements may be made without departingfrom the spirit and scope of the invention. The foregoing description ofthe preferred embodiment of the invention has been presented forpurposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form or to exemplaryembodiments disclosed. Accordingly, the foregoing description should beregarded as illustrative rather than restrictive. Obviously, manymodifications and variations will be apparent to practitioners skilledin this art. The embodiment is chosen and described in order to bestexplain the principles of the invention and its best mode practicalapplication, thereby to enable persons skilled in the art to understandthe invention for various embodiments and with various modifications asare suited to the particular use or implementation contemplated. It isintended that the scope of the invention be defined by the claimsappended hereto and their equivalents in which all terms are meant intheir broadest reasonable sense unless otherwise indicated. It should beappreciated that variations may be made in the embodiments described bypersons skilled in the art without departing from the scope of thepresent invention as defined by the following claims.

1. A memory heatsink set with supplementary retaining devices,comprising: a first memory heatsink and a second memory heatsink, saidfirst memory heatsink and said second memory heatsink being narrowelongated strip members, each having a top bearing flangeperpendicularly extended from a top side thereof; at least one guidedevice provided between the top bearing flanges of said first memoryheatsink and said second memory heatsink for positioning during theassembly process of the memory heatsink set and for guiding said firstmemory heatsink and said second memory heatsink into alignment; twosupplementary retaining devices respectively provided at two endsbetween said first memory heatsink and said second memory heatsink, eachsaid supplementary retaining device comprising first engagement meansand second engagement means respectively located on one end of saidfirst memory heatsink and one corresponding end of said second memoryheatsink for supporting a memory module in between said first memoryheatsink and said second memory heatsink, said first engagement meanscomprising a main engagement opening and at least one sub-engagementopening arranged in a parallel manner at the free end thereof, said mainengagement opening having a relatively narrower outer end and arelatively wider inner end, said second engagement means comprising amain engagement block and at least one sub-engagement block disposedarranged in a parallel manner at the free end thereof for engaging themain engagement opening and at least one sub-engagement opening of saidfirst engagement means respectively, said main engagement block having arelatively thicker outer end and a relatively thinner inner end.
 2. Thememory heatsink set with supplementary retaining devices as claimed inclaim 1, wherein said first engagement means further comprises a spacerblock disposed between said main engagement opening and each saidsub-engagement opening, said spacer block having a recessed portion at aroot thereof; each said sub-engagement block of said second engagementmeans has a configuration fitting the associating sub-engagement openingand a root expanding in direction toward said main engagement block. 3.The memory heatsink set with supplementary retaining devices as claimedin claim 1, wherein said first engagement means further comprises alocating groove disposed in each said sub-engagement opening; each saidsub-engagement block has a locating protrusion for engaging the locatinggroove in the respective sub-engagement opening.
 4. The memory heatsinkset with supplementary retaining devices as claimed in claim 2, whereinsaid first engagement means further comprises a locating groove disposedin each said sub-engagement opening; each said sub-engagement block hasa locating protrusion for engaging the locating groove in the respectivesub-engagement opening.
 5. The memory heatsink set with supplementaryretaining devices as claimed in claim 1, wherein each said guide devicecomprises first retaining means and second retaining means respectivelylocated on the top bearing flange of said first memory heatsink and thetop bearing flange of said second memory heatsink for engagement witheach other to prohibit displacement between said first memory heatsinkand said second memory heatsink in left-right direction and to hold saidfirst memory heatsink and said second memory heatsink in alignment. 6.The memory heatsink set with supplementary retaining devices as claimedin claim 2, wherein each said guide device comprises first retainingmeans and second retaining means respectively located on the top bearingflange of said first memory heatsink and the top bearing flange of saidsecond memory heatsink for engagement with each other to prohibitdisplacement between said first memory heatsink and said second memoryheatsink in left-right direction and to hold said first memory heatsinkand said second memory heatsink in alignment.
 7. The memory heatsink setwith supplementary retaining devices as claimed in claim 5, wherein saidfirst retaining means comprises a first retaining block protruded fromthe top bearing flange of one of said first memory heatsink and saidsecond retaining means, and said second retaining means comprises twosecond retaining blocks protruded from the top bearing flange of theother of said first memory heatsink and said second memory heatsink anddefining therebetween a space for the engagement of said first retainingblock.
 8. The memory heatsink set with supplementary retaining devicesas claimed in claim 6, wherein said first retaining means comprises afirst retaining block protruded from the top bearing flange of one ofsaid first memory heatsink and said second retaining means, and saidsecond retaining means comprises two second retaining blocks protrudedfrom the top bearing flange of the other of said first memory heatsinkand said second memory heatsink and defining therebetween a space forthe engagement of said first retaining block.